US semiconductor giant, Micron, has announced its upcoming launch of HBM4 memory products in 2026, followed by HBM4E in 2027/2028. These high-bandwidth memory solutions are set to offer advanced AI and data center applications with 64GB and 2TBps capabilities. Micron’s President and CEO, Sanjay Mehrotra, highlighted the company’s commitment to the growing HBM market, projecting significant growth in the coming years. With a focus on enhancing performance and efficiency, Micron aims to make a mark in the competitive landscape alongside industry leaders like Nvidia and AMD. Despite being a newcomer, Micron remains confident in its technology roadmap and partnerships, positioning itself as a key player in the high-bandwidth memory industry.